Dale Barkey

Dale Barkey

Professor of Chemical Engineering


  • Ph.D., Chemical Engineering, University of California at Berkeley, 1987
  • M.S., Chemical Engineering, University of Cincinnati, 1982
  • B.A., Chemistry, Clark University, 1979

Research Interests

Electrodeposition, Anodizing, Electrochemical Engineering.

Courses Taught

  • CHE 501/502:  Introduction to Chemical Engineering I & II
  • CHE 604:  Chemical Engineering Thermodynamics
  • CHE 703:  Mass Transfer and Stagewise Operations
  • CHE 744:  Corrosion
  • CHE 915:  Heat Transfer

Recent Publications:

  • E. Garcia-Cardona, E.H. Wong and D. P. Barkey , NMR Spectral Studies of Interactions between the Accelerants SPS and MPS and Copper Chlorides, Journal of the Electrochemical Society, 158 D143 (2011).
  • D. Barkey and J. McHugh, Pattern Formation in Anodic Aluminum Oxide Growth by Flow Instability and Dynamic Restabilization, Journal of the Electrochemical Society, 154, C388 (2010).
  • Z. Zhang and D.P. Barkey, Nucleation of Tin and Tin-Silver Alloy on Copper and Nickel in Acid Plating Baths, Journal of the Electrochemical Society, 154, D550 (2007).
  • K. Kondo, T. Yonezawa, D. Mikami, T. Okubo, Y. Taguchi, K. Takahashi and D. Barkey, High-Aspect-Ratio Copper-Via-Filling for Three- Dimensional Chip Stacking -2) Reduced Electrodeposition Process-Time, Journal of the Electrochemical Society, 152, H173 (2005).
  • M.A. Pasquale, D.P. Barkey and A.J. Arvia, Influence of Additives on the Growth Velocity and Morphology of Two Dimensional Copper Electrodeposits, Journal of the Electrochemical Society, 152, C149 (2005).
Kingsbury W305
(603) 862-1918